SecuriFlex research project

Integration of flex-chips into security documents
The most important goal of the SecuriFlex project which was sponsored by Berlin-based Investitionsbank (IBB) and co-financed by the European Regional Development Fund (ERDF) was to develop new processes for integrating ultra-thin chips into value and security documents and to investigate innovative production processes. In contrast to the current state of the art, the chips were to be directly integrated into the carrier substrate (foil or paper) rather than via a so-called chip module.

In order to achieve the project goals, the antennas were first printed and function-tested on PC foil and paper, respectively, at the test bays at Bundesdruckerei and Fraunhofer Institute for Reliability and Microintegration (IZM). Following the subsequent step of chip assembly at IZM, Bundesdruckerei then performed the process steps of impedance measurement, card manufacture and laser engraving. The subsequent reliability studies and analyses were accompanied by both partners.

In the final report on their joint work, the project partners found: In the SecuriFlex project, it was possible to integrate ultra-thin, contactless ICODE chips into smart cards on a polycarbonate basis. The antennas which were directly applied to the foil substrate of the cards by way of silkscreen printing and the chips which were fitted using the ACA cementing process formed a functioning RF inlay which was successfully integrated with all the other foil layers to form a homogenous security card. The reliability tests yielded reliable statements concerning performance stability and service life of the developed security documents with integrated flex-chip technology. The demonstrators were found to be extremely robust in numerous test cycles. This is proof that the card materials selected are capable of performing "module functions" and that flexible chips can be directly integrated into demanding high-security documents. The basis data from the SecuriFlex project constitutes a sound basis for Bundesdruckerei in order to further promote the area of chip & contactless technologies and the development of new generations of ID documents.

Facts and figures of the SecuriFlex research project:
Sponsored: by Investitionsbank Berlin (IBB), co-financed by the European Regional Development Fund (ERDF)
Project coordinator: Bundesdruckerei GmbH
Project partners: Bundesdruckerei GmbH, Fraunhofer Institute for Reliability and Microintegration (IZM)
Project term: 01 February 2006 to 31 July 2007